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Fri, 12 Mar 2010 16:35:00 GMT
National's Revenues, Profits, Up
National Semiconductor has increased revenues and profits in the three months to the end of February.
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Fri, 12 Mar 2010 11:55:00 GMT
'Most accurate' DAC aims for MRI scanners
Analog Devices has introduced industry's most accurate monolithic digital-to-analogue converter. Designed in Edinburgh, the AD5791 20bit DAC has 1ppm resolution...
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Fri, 12 Mar 2010 11:52:00 GMT
Will election worries hit business confidence?
“We are operating in very unusual market conditions in what continues to be a fragile overall economic environment, exacerbated by uncertainty about the forthcoming general election in the UK,” said Adam Fletcher of Afdec
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Fri, 12 Mar 2010 10:58:00 GMT
Distributor takes on GaN chip line for mosfet replacement
Last year, EPC introduced its first commercial enhancement-mode GaN transistors. The supplier claims these can have “characteristics similar to silicon power mosfets”
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Fri, 12 Mar 2010 10:42:00 GMT
PCB design firm offers free cost analysis
The Port Talbot-based consultancy said it will offer new projects a free analysis of their design and a report on the findings
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Fri, 12 Mar 2010 10:03:00 GMT
Applied expands Taiwan flat panel, solar manufacturing facility
To improve its ability to serve flat panel display (FPD) and thin film solar photovoltaic (PV) customers in Asia while capitalising on Taiwan's location, talent pool and supply chain infrastructure, capital equipment giant Applied Materials announced this week that its newly expanded Tainan Manufacturing Centre in Tainan, Taiwan is now open.
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Fri, 12 Mar 2010 09:47:00 GMT
European chip business is looking chipper
“The European semiconductor industry leading indicator continues to grow, although the pace continues to slow, as noted last month, " commented Maria Simos, CEO of e-forecasting.com
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Fri, 12 Mar 2010 07:23:00 GMT
NI to support renewable energy product development
“With so much development in the areas of renewable energy and medical systems being carried out by small companies we feel this is an important initiative,” Ian Bell, market development manager at National Instruments told EW
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Fri, 12 Mar 2010 06:51:00 GMT
MoD deploys SDR transceivers in Sea King helicopter fleet
The MoD has bought 40 multi-band radios from Rohde & Schwarz to equip the Sea King HAR 3 fleet and the training Flight Simulator
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Fri, 12 Mar 2010 02:00:00 GMT
Win a place at Future Horizons IEF 2010
Future Horizons is giving away one free place (not including transport or accomodation costs) worth €2,900 at its International Electronics Forum 2010 in Dresden on May 5th
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Thu, 11 Mar 2010 18:51:00 GMT
ARM sets sights on tablet market
ARM CEO Warren East is on record predicting that ARM processor cores could be in as many as six million computers this year
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Thu, 11 Mar 2010 11:12:00 GMT
TSMC To Hire 2,400
TSMC is to hire 2,400 new permanent staff.
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Thu, 11 Mar 2010 11:03:00 GMT
Motorola opens mobile search with Microsoft move
The question remains: is this a move specific to the China market, where Google, the world-leading search engine, has had well publicised issues, or does it reflect a wider trend
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Thu, 11 Mar 2010 10:06:00 GMT
ST chip targets pay-TV hackers
STMicroelectronics is sampling the first devices to incorporate new security technology for prevent hacking of pay-TV broadcast signals. According to ST, the intention is to address the illicit decryption of signals for viewing or redistribution which can cost billions of dollars per year to broadcasters in lost revenues
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Thu, 11 Mar 2010 09:51:00 GMT
PCB firm sees business growth, China looks strong
In the UK, 70% of Graphic’s turnover is military and aerospace and the rest is for specialist applications such as formula one motor-racing, medical and marine products
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Thu, 11 Mar 2010 09:32:00 GMT
Embedded design tools will be in the cloud
Guest columnist Mike Beunder believes it is only a matter of time before a complete embedded software tool chain is found in the cloud
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Thu, 11 Mar 2010 08:24:00 GMT
Space chip company opens design centre in Europe
Peregrine Semiconductor has opened a design and engineering facility at Aix-en-Provence in France. It represents a new and expanded European business arm for the US-based supplier of silicon RF chips
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Wed, 10 Mar 2010 17:31:00 GMT
IAR and Express Logic hit 32-bit MCUs with integrated tools
Both Express Logic and IAR Systems products support the most commonly used 32-bit architectures including ARM's ARM7, ARM9 and Cortex-M3, Freescale's ColdFire, NEC's V850, and Renesas's H8
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Wed, 10 Mar 2010 13:26:00 GMT
Need for efficiency stabilises audio amplifier chip design
Pushed by power efficiency requirements, integrated audio amplifier architectures are settling down, with Class-D at the top end and Class-AB at the bottom,...
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Wed, 10 Mar 2010 13:02:00 GMT
200W mains chip stands by on 100mW
Mains PSU chip firm Power Integrations has introduced a low-stand-by family for TVs, set-top boxes and printers.
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Wed, 10 Mar 2010 10:39:00 GMT
Cost of 32-bit microcontrollers is tumbling
To reduce the price, changes have been made in design, production processing and test, for example, the on-chip variable oscillator is no longer calibrated, and the tolerances have been widened on some analogue blocks
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Wed, 10 Mar 2010 10:32:00 GMT
Fast flash and floating point boost MCUs
Microcontroller suppliers are looking to increase the performance of devices through fast flash memory technology and the integration of floating point units
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Wed, 10 Mar 2010 10:13:00 GMT
How sensory feedback will improve touch
Guest columnist Eric Itakura from IDT outlines the importance of providing user feedback in the area of touch control design
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Wed, 10 Mar 2010 09:39:00 GMT
TierLogic Launches 3D FPGAs
Today, TierLogic breaks out of its seven years in Stealth Mode to launch its 3D FPGAs. The company is open for business now, and is offering free NREs to early adopters. TierLogic's approach is to make a monolithic chip which can act both as an FPGA and an ASIC.
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Tue, 09 Mar 2010 16:57:00 GMT
IMEC and Synopsys collaborate on 3D stacked IC development
Belgian lab IMEC is to use Synopsys' finite-element method tools for characterising through-silicon vias in 3D stacked IC technologies.
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